Telekom Malaysia and Huawei develop next-gen technology

12 August 2014 |


Chinese vendor Huawei has partnered with Telekom Malaysia (TM) subsidiary Telekom Research and Development (TM R&D) to co-develop next-generation access technologies for fixed-line and mobile operators in Malaysia.

The two companies have signed a memorandum of understanding (MoU) to jointly research customised copper access and 4G solutions for telecoms networks in the country, and encourage information sharing.

“With strong commitment from both parties, we are confident of contributing to a competitive next-generation ICT infrastructure for the nation,” said Gopi Kurup, CEO at TM R&D. “The collaboration reflects our commitment to evolve the nation’s HSBB [high-speed broadband] network project and underpins the long-term value of TM’s current assets.”

A joint lab has also been established in the TM Innovation Center in Cyberjaya, Malaysia and Huawei Malaysia CEO Mike Wang expects the partnership to enable the next level of “digital life” for consumers and businesses across the country.

“By jointly developing technologies that utilise TM’s existing copper wires, TM can make efficient use of resources, quickly implement bandwidth strategies and launch additional new services, including IPTV and HDTV based on the fast broadband to score more commercial success,” Wang said.

Huawei devotes 10% of its yearly revenue to R&D, and in January 2013, opened an R&D centre in Ireland.